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The circuit board factory will show you the manufacturing process of HDI board resin plug hole

With the development of microminiaturization of assembly components, the wiring area and pattern design area of PCB are also decreasing, and PCB manufacturers are constantly updating the manufacturing process to meet the development trend. As a result, the application of resin plug hole technology has become more and more extensive, which is mostly used in HDI blind buried orifice plate.

  1. Resin plug hole of POFV technology

The holes are filled with resin and plated with copper. This structure is called a VIP hole (Via In Pad), and the production process is called POFV (Plated On Filled Via). The advantage of POFV technology is to reduce the hole to hole spacing, reduce the area of the board, solve the problem of wire and wiring, and improve the wiring density.

  1. Technical principle of inner HDI resin plug hole

Plug the embedded hole of the inner HDI with resin, and then press it. This process balances the contradiction between the thickness control of the pressed medium layer and the design of HDI buried hole filling. If the HDI embedded hole in the inner layer is not filled with resin, the plate will be directly scrapped due to the problem of plate bursting during overheating impact; If the resin plug hole is not used, multiple sheets of PP are required to be pressed to meet the needs of glue filling. However, the thickness of the medium layer between layers will be thicker due to the increase of PP sheets.

  1. Through hole resin plug hole

In some 3G products, because the thickness of the board is more than 3.2mm, in order to improve the reliability of the product, or to improve the reliability of the green oil plug hole, under the permission of the cost, people also use resin to plug the through hole. This is a major product category that has been popularized in recent years.



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