The test method for pressing auxiliary materials of FPC flexible circuit board is as follows:
Appearance inspection: the surface is smooth and clean, without cracks, cracks, particles, bubbles, pinholes and foreign impurities. Thickness: measure with micrometer, take five points for measurement, read and record the data. Dimension: measure with a ruler or tape, take equal sides for measurement, read data and record.
- Temperature resistance test of fired iron plate, green silica gel, silicon aluminum foil and glass fiber cloth FPC accessories (silicone oil precipitation).
- High temperature resistant tape FPC auxiliary material temperature resistance test: continuously raise the temperature of the high temperature resistant tape for temperature resistance test (temperature: 200 ℃; preloading: 10s; molding time: 180s; pressure: 120kg/cm2 for 10~20 consecutive operations), and no brittle fracture is allowed.
- Temperature resistance test of FPC auxiliary materials of release film: the release film shall be continuously heated for temperature resistance test (temperature: 200 ℃; prepressing: 10s; molding time: 180s; pressure: 120kg/cm2 for 5~10 consecutive operations), and no brittleness is allowed. Silicon oil precipitation test: press the copper foil and the sample release film (temperature: 180 ℃; preheating time: 10s; molding time: 180s; pressure: 100kg/cm2), press for 3 to 5 times continuously, and then conduct nickel plating test after pretreatment. After nickel plating, observe with a 10x magnifying glass, and no copper exposure is allowed.