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Application Advantages and Development Prospects of FPC FPC

FPC FPC is mainly used for the connection of electronic products. It exists as the medium of signal transmission, and has high reliability and excellent flexibility. FPC FPC has the advantage of high wiring and assembly density, eliminating the connection of redundant flat wires; Good bending property, high flexibility and high reliability; Small volume, light weight and thin thickness; Circuit can be set, wiring layer and flexibility can be increased; Simple structure, convenient installation and consistent installation.

FPC FPCs can be classified in different ways, and can be divided into flexible PCB and rigid flexible PCB according to flexibility; According to the number of layers, it can be divided into single-layer flexible circuit board, double-layer flexible circuit board and multi-layer flexible circuit board.

The application fields of FPC FPC can be divided into smart phones, wearable devices and automotive electronics. The application on smart phones covers battery module, display module, touch module, camera module, connection module, etc. A smart phone needs to carry 10-15 FPC FPCs. With the commercial use of 5G, the development of smart phones towards miniaturization and large screen, the rise of folding screen phones, etc., will increase the use of FPC FPC. The demand for FPC FPC in the smartphone field is on the rise.

In the field of wearable devices, FPC FPC is the main application material, and the development of wearable devices will increase the demand for FPC FPC.

In the field of automotive electronics, FPC FPC can reduce the complexity of the process and small size, effectively reduce weight and save costs. With the development of automobile electronics, sensors, central control panel and other components have an increasing demand for FPC FPC, which brings broad space for the application of FPC FPC.

The demand for FPC FPCs in the electronic industry is growing. First, FPC FPCs have excellent characteristics and are suitable for the ultra-thin requirements of electronic products; Second, in the high frequency and high speed transmission of circuits, the reliability of FPC FPC is required to be high. Therefore, the market scale of FPC FPC in the electronic industry is constantly expanding.

The performance of FPC FPC needs to be inspected through tests, including appearance test, electrical performance test and environmental performance test. The basic test standards include substrate film, coating appearance, coating process, deviation between connecting disc and coating, voltage resistance, bending resistance, welding resistance, temperature and humidity resistance, salt spray resistance, etc. It is divided into intermediate test and final test. It is qualified only after all routine performance of the two tests are up to standard.

FPC FPC testing can be realized with the help of the chip micro needle module, which is conducive to improving testing efficiency and reducing production costs. In the large current transmission, the shrapnel microneedle module can carry up to 50A of current, and the minimum response value in the small pitch field can reach 0.15 mm. The connection is stable and reliable, with an average service life of more than 20w times, and the adaptability is extremely high.

With the emergence of emerging electronic products, the market and use of FPC FPC also expand, and the upgrading of different types of electronic products will bring more considerable development prospects than the traditional market. The FPC FPC FPC test selects the appropriate spring micro needle module, which will greatly increase the product output and usher in the expansion mode.



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