OEM and ODM services for FPC/PCB products
There are many reasons for FPC FPC FPC glue overflow, which are related to FPC manufacturer’s process parameters, storage environment, staff’s operation mode, and the processing process of protective film (COVERLAY). The following are discussed from specific factors:
- Parameter causes of protective film (COVERLAY) during manufacturing
When CL enters the drying stage after coating, improper control of temperature, time and other parameters will lead to excessive flow of the adhesive system in the semi curing process. In addition, if the distribution of CL glue system is uneven during coating, it is difficult to control the amount of glue overflow during pressing.
- Overflow of protective film (COVERLAY) and reasons for storage environment
At present, the storage condition of TAIHONG COVERLAY is below 10 ℃, the optimal storage temperature is 0 ℃ – 5 ℃, and the storage time is 90 days. If the storage time is exceeded or the storage conditions fail to meet the requirements, COVERLAY is easy to absorb moisture in the air, resulting in instability of the adhesive system, and it is easy to produce glue overflow.
- Whether the customer’s product structure is reasonable is an important reason for glue overflow
In the process of product design, the collocation of FCCL and CL should be as reasonable as possible. If the thickness of the COVERLAY adhesive system is too far away from the thickness of the copper foil of the base material, glue spillage is likely to occur, and the structural collocation of FPC FPCs should be avoided from the source.
- The special design of FPC FPC products will also lead to local glue overflow
With the emergence of high-precision products, independent PAD bits are designed in some FPC FPC products. In the process of pressing and heating up, because there is no gap around it, the smaller the PAD position is, the more obvious the glue overflow phenomenon is.
- The cause of glue overflow and the process parameter setting of FPC FPC FPC factory
In the setting of process parameters, if the pressure is too large, the time is too long, and the pressure of the press is uneven, glue overflow may occur. In addition, the control of overflow is also related to the adhesive absorption performance of the bymaterials for hot pressing.