The single-sided FPC FPC flexible circuit board has only one layer of chemically etched conductive pattern. The conductive pattern is calendered copper foil material, and the insulation substrate can be polyimide, polyethylene terephthalate, aramid fiber ester, PVC and other materials. Single side FPC can be divided into four sub categories: 1. Single side connection without covering layer; 2. Single side connection with covering layer; 3. Double side connection without covering layer; 4. Double side connection with covering layer.
The double-sided FPC flexible circuit board is a conductive pattern made of a layer of etching on both sides of the insulating base film, which increases the wiring density per unit area. The metallized hole connects the figures on both sides of the insulating material to form a conductive path to meet the design and use functions of flexibility. The covering film can protect the single and double sided wires and indicate the location of the components.
Multilayer FPC FPC flexible circuit board is to laminated three or more layers of single-sided or double-sided flexible circuits together to form metallized holes through drilling and electroplating to form conductive paths between different layers. Multilayer FPC circuit boards have huge functional differences in terms of higher reliability, better thermal conductivity and more convenient assembly performance.